{"start":0,"take":1,"total":1,"items":[{"activityNumber":"1000045263","budgetReference":"E/0534-01K - IC1 - Advanced Techn","classified":false,"closingDate":"2027-01-11T13:00:00","extensionRequestDeadline":"2026-12-28T13:00:00","clarificationRequestDeadline":"2026-12-28T13:00:00","description":"Objective: The objective of the activity is to design, build and test a highly integrated and efficient millimetre-wave phased array antenna using advanced packaging solution for multi-chip,multi-technology assembly, including 3-dimensional heterogeneous integration interconnects, thermal and power management.Targeted Improvements:Enabling disruptive technology to enable thermal management of highly integrated phased arrays, with a twice the RF power handling capability.Description: The development and deployment of millimetre-wave phased array antennas present several challenges that can reduce their efficiency and performance. These challenges include low RF power per element across different orbits (Low Earth Orbit (LEO), Medium Earth Orbit (MEO), and Geostationary EarthOrbit (GEO)) due to the use of silicon chips and the inefficiency in thermal management. Further limitations are introduced by the use of 2D packaging, which prevents the integration of high-power handling capabilities and enhanced thermal management technologies.The power efficiency and dependability of the antenna are reduced by signal strength degradation caused by the low RF output power per element. These performance issues directly affect satellite-to-ground communication as well as intersatellite communication.Toovercome these limitations, transitioning from 2D to 3D Heterogeneous Integration (3DHI) interconnect technology can significantly improve the thermal and power performance of phased array antennas. By stacking components vertically, more space can be allocated for effective thermal management, and the integration of multiple layers with thermal vias allows for better heat dissipation. This approach also enables the integration of diverse materials and technologies within the same package. Novel materials like Gallium Nitride (GaN) and Silicon Carbide (SiC) offer superior thermal conductivity and higher power handling capabilities compared to traditional silicon. Incorporating thesematerials into the antenna array, using an Integrated Antenna-on-Chip (AoC) approach, can increase the RF power per element while alleviating thermal constraints.This activity will be implemented in a phased approach:- Phase 1 will develop an antenna concept, investigate and develop key processes necessary to fabricate a millimetre-wave 3DHI active antenna.This includes integrating low-power silicon chips, RF power amplifiers, thermal management solutions and advanced packaging techniques. During this phase, critical components will be developed to breadboard level to assess the effectiveness of 3D packaging methods, such as vertical integration and thermal vias, in addressing thermal dissipation and RF power handling challenges. Phase 1 outputwill deliver an antenna concept supported by critical breadboard test results. The budget for Phase 1 is up to 1,000 kEuro.- Phase2 will focus on developing a scaled engineering model of a millimetre-wave phased array antenna using 3DHI technology in Q, V, orW-Bands. Phase 2 will include refining the design, manufacturing, and testing the antenna's performance in representative operational environments.","ecosrequired":false,"establishment":"ESTEC","firstPublicationDate":"2026-10-28T17:17:07","id":197813,"idEra":25827,"initiatingService":"RNC-FTS","ipmeasure":"N/A","isArchived":false,"isCancelled":false,"isReissued":false,"isToBeReissued":false,"issueQuarter":"263","lastUpdateTime":"2026-10-28T17:17:37","lastUpdateUser":"sapancot","openDate":"2026-10-28T17:17:32","priceRange":"> 500 KEURO","programmeReference":"IC1 - Advanced Techn","tanumber":"1-13591","title":"HIGHLY-INTEGRATED AND EFFICIENT MILLIMETRE-WAVE PHASED ARRAY ANTENNA USING ADVANCED PACKAGING SOLUTION (ARTES AT 5B.258) - RE-ISSUE","directorate":null,"countries":[{"id":1},{"id":168},{"id":67},{"id":62},{"id":26},{"id":24},{"id":23},{"id":22},{"id":19},{"id":17},{"id":16},{"id":15},{"id":13},{"id":12},{"id":11},{"id":10},{"id":9},{"id":7},{"id":6},{"id":5},{"id":4},{"id":2}],"products":[{"id":356}],"technologies":[{"id":203}],"status":{"id":2},"tenderType":{"id":5},"isFavourite":false,"eraVersion":2,"stageNumber":null,"isNew":false,"isUpdated":false,"declarationOfCompliances":["With regard to the technical requirements of the ITT/RFQ, the tender is","With regard to the requirement that the “consortium structure” in esa-star mirrors the Proposed Project Team in the Cover Letter, the tender is","With regard to the requirements in ESA’s Policy on the Prevention, Detection and Investigation of Fraud (special reference is made to paragraph 5.8), the tenderer is","With regard to the Agency’s “Right to Audit” (see Part 2, section 2.2.8 of the ESA Tender Conditions), the tender is","With regard to the export/import requirements of the ITT (please refer to the Proposal Template, Section 6.4), the tender is","With regard to the IPR requirements of the ITT (please refer to the Draft Contract and to the Proposal Template, Section 6.2), the tender is","With regard to the Contract conditions of the ITT (please refer to the Draft Contract and to the Proposal Template, Section 6.1), the tender is","With regard to the financial requirements of the ITT/RFQ, the tender is","With regard to the managerial requirements of the ITT, the tender is","The technical proposal is free from any plagiarism. When use is made of material being quotations or citations from existing public literature, such use is clearly indicated and due reference indications (source and author) are provided.","With regard to the validity period of 4 months from the date of tender submission with implicit extensions as per Article 27, paragraphs 3&4 of the Contracting Regulations ESA/REG/001, the tender is"],"keyAcceptanceFactors":["Mandatory for ARTES 4.0 Core Competitiveness Generic Programme Line - Component A: Advanced Technology:\nSupporting evidence of the authorisation of funding for Phase 1 from the relevant Participating State(s) is provided as part of the tender cover letter and in accordance with the requirements of section 2.4 of the Cover letter to the present ITT.","The Tenderer satisfies the qualification requirements established under Article 12. Paragraphs 1 and 2 of the Contracting Regulations. The Tenderer further certifies that it, and when applicable any of its subcontractors, does not fall under any of the exclusions laid down in the Contracting Regulations under Article 12, paragraphs 3 and 14.","The Tenderer confirms, on its behalf and on behalf of its Subcontractor(s), to be compliant with the requirements listed in the “Certification of free competition” (see section 2.2.3 of the ESA Tender Conditions).","The Tenderer confirms, on its behalf and on behalf of its Subcontractors, the acceptance of the conditions listed in the “Non commitment by the Agency” (seesection 2.2.12 of the ESA Tender Conditions ).","The Tenderer confirms, on its behalf and on behalf of its Subcontractors, to be compliant with the requirements listed in the “Certification of non-benefit” (see section 2.2.4 of the ESA Tender Conditions ).","The tender Cover Letter and the tender contain a binding price for Phase 1.","The tender contains a technical description.","The tender Cover Letter and the tender contain a price type compliant with those ones requested in the ITT.","The tender is compliant with the budgetary limit(s) applicable to the tender for both Phase 1 and Optional Phase 2.","The Proposal includes the three (3) mandatory elements for Phase 2 of the activity"],"evaluationCriterias":[{"criterion":"Understanding of the scope, capability to implement and motivation and benefit to carry out the Optional Phase 2 of the activity","weightingFactor":"15%"},{"criterion":"Compliance with administrative tender conditions and acceptance of Contract conditions.","weightingFactor":"5%"},{"criterion":"Adequacy of planning, management and costing  for the execution of the work.","weightingFactor":"10%"},{"criterion":"Quality and suitability of proposed programme of work; adequacy of engineering approach.","weightingFactor":"30%"},{"criterion":"Understanding of the requirements and objectives and discussion of problem areas.","weightingFactor":"25%"},{"criterion":"Background and experience (related to the particular field concerned) of the company(ies) and staff, including adequacy of proposed facilities","weightingFactor":"15%"}],"entities":[],"procurementProposal":null,"responsible":"Nathalie Dorval","updateReason":"Tender Action Issued"}],"totalNew":0,"totalUpdated":0}