{"start":0,"take":1,"total":1,"items":[{"activityNumber":"1000046081","budgetReference":"E/0534-01K - IC1 - Advanced Techn","classified":false,"closingDate":"2026-12-03T13:00:00","extensionRequestDeadline":"2026-11-19T13:00:00","clarificationRequestDeadline":"2026-11-19T13:00:00","description":"The objective of the activity is to develop a highly integrated, scalable Ku or Ka-band TX/RX direct radiating array, for versatileconnectivity missions in low earth orbit. Critical breadboarding will be carried out, levering the advances in Mm-wave silicon technologies and advanced packaging techniques to achieve a high degree of integration. Targeted Improvements: Enabling highly integrated combined transmit and receive active antenna with a large number of elements, for low earth orbit applications, not existing today. Description: Mm-wave silicon technologies together with advanced packaging and printed circuit board technologies are the key enablers of high-volume active antennas today. To achieve the equivalent isotropic radiated power (EIRP) required by LEO constellationsatellites, power levels of up to 20dBm are needed in 2000+ element class arrays. At the same time, noise figure levels approaching1dB at Ka band can significantly improve the performance of next generation arrays. Multibeam beamforming operation can be obtainedby several beamforming strategies that have only been possible thanks to the recent advancements in silicon technologies. To allow affordable high-volume manufacturing of reliable arrays, packaging and PCB integration are of equal importance as the semiconductor technology itself and they all need to be considered in co-design. This activity will develop in a first step a scalable Ku- or Ka-band direct array transmit and receive architecture taking into account aspects including beamforming, low noise and high-efficiency power amplification, filtering, control, switching, interconnections, PCB routing and thermal control. Mm-wave silicon technologies and packaging techniques will be reviewed, and a technology baseline will be selected for all critical antenna elements. Thermal management and spacecraft accommodation will be taken into account to maximise integration. In a second step a sub-array breadboard with radiating elements will be designed manufactured and tested. The breadboard shall be sufficient to evaluate the functionality of the direct radiating architecture and to test the RF and thermal management concept.","ecosrequired":false,"establishment":"ESTEC","firstPublicationDate":"2026-10-22T16:24:53","id":197437,"idEra":25831,"initiatingService":"RNC-FTS","ipmeasure":"N/A","isArchived":false,"isCancelled":false,"isReissued":false,"isToBeReissued":false,"issueQuarter":"263","lastUpdateTime":"2026-10-22T16:25:26","lastUpdateUser":"sapancot","openDate":"2026-10-22T16:25:22","priceRange":"> 500 KEURO","programmeReference":"IC1 - Advanced Techn","tanumber":"1-13396","title":"HIGHLY INTEGRATED TRANSMIT AND RECEIVE DIRECT RADIATING ANTENNA ARRAY BASED ON MM-WAVE SILICON TECHNOLOGIES AND PACKAGING (ARTES AT 5B.241) RE-ISSUE (1-12262) EXPRO+","directorate":"Dir. of Connectivity  Secure Comm.","countries":[{"id":1},{"id":168},{"id":67},{"id":62},{"id":26},{"id":24},{"id":23},{"id":22},{"id":19},{"id":17},{"id":16},{"id":15},{"id":13},{"id":12},{"id":11},{"id":10},{"id":9},{"id":7},{"id":6},{"id":5},{"id":4},{"id":2}],"products":[{"id":378}],"technologies":[{"id":196}],"status":{"id":2},"tenderType":{"id":5},"isFavourite":false,"eraVersion":2,"stageNumber":null,"isNew":false,"isUpdated":false,"declarationOfCompliances":["All the required declarations of compliance have been addressed and included in our proposal's Cover Letter."],"keyAcceptanceFactors":["The Tenderer confirms, on its behalf and on behalf of its Subcontractor(s), to satisfy the “Eligibility Requirements” (see section 1.1 of the EXPRO/TC);","The Tenderer confirms, on its behalf and on behalf of its Subcontractor(s), to fulfil the requirements concerning “Free Competition” (see paragraph 11 of the Cover Letter of the Proposal Template);","The Tenderer confirms, on its behalf and on behalf of its Subcontractor(s), to accept the conditions established for “Non commitment by the Agency in competitive procurements” (see section 1.7 of the EXPRO/TC);","The Tenderer confirms, on its behalf and on behalf of its Subcontractor(s), to be compliant with the “Non Benefits Requirements” (see section 1.8 of the EXPRO/TC);","The Tenderer confirms that the tender Cover Letter and the Detailed Proposal contain a binding price;","The Tenderer confirms that the tender Cover Letter and the Detailed Proposal contain a price type compliant with the one requested in the ITT;","The Tenderer confirms that the tender is compliant with the budgetary limit applicable to the ITT;","The Tenderer confirms that Supporting evidence of the authorisation of funding from the relevant Participating State(s) is provided as part of the Tender cover letter and in accordance with the requirements of section 4 of the Cover letter to the present ITT."],"evaluationCriterias":[{"criterion":"Background and experience (related to the particular field concerned) of the company(ies) and staff, including adequacy of the proposed facilities.","weightingFactor":"25%"},{"criterion":"Understanding of the objectives of the activity and discussion of the problem areas, and adequacy of the programme of work","weightingFactor":"55,00000000000001%"},{"criterion":"Adequacy of the time dedication and costing, compliance with administrative tender conditions and acceptance of the contract conditions","weightingFactor":"20%"}],"entities":[],"procurementProposal":null,"responsible":"Florence Glandieres","updateReason":"Tender Action Issued"}],"totalNew":0,"totalUpdated":0}